application packaging

The Supreme HR Advisory Pte. Ltd. is seeking a semiconductor packaging engineer to lead design, development, and optimization of die bonding processes at our Woodlands North Coast site. The role involves translating customer requirements into robust packaging solutions and providing hands-on on-site support. Responsibilities include troubleshooting, tool...

Achieve Group in Singapore seeks a senior leader to drive semiconductor equipment applications and lead customer-facing teams across process integration. You will translate customer needs into tool specifications and oversee test vehicles, acceptance criteria and demos.With hands-on advanced packaging experience (hybrid bonding, D2W/W2W, TCB or flip-chip)...

The Supreme HR Advisory Pte. Ltd. is seeking a semiconductor packaging engineer to lead design, development, and optimization of die bonding processes at our Woodlands North Coast site. The role involves translating customer requirements into robust packaging solutions and providing hands-on on-site support.Responsibilities include troubleshooting, tool...

The Supreme HR Advisory Pte. Ltd. is seeking an engineer to lead the design, development, and validation of software and hardware for advanced die bonding processes in Woodlands North Coast. You will analyze customer needs and translate them into packaging solutions, driving process optimization and performance. Responsibilities include troubleshooting,...

The Supreme HR Advisory Pte. Ltd. is seeking an experienced engineer to lead design, development, optimization, and validation of software and hardware for advanced die bonding processes in a Singapore facility.The role requires translating customer requirements into packaging solutions, performing setup and calibration, and conducting troubleshooting and...

The Supreme HR Advisory Pte. Ltd. is seeking an engineer to lead the design, development, and validation of software and hardware for advanced die bonding processes in Woodlands North Coast.You will analyze customer needs and translate them into packaging solutions, driving process optimization and performance. Responsibilities include troubleshooting,...

Lead applications, process integration, field service and on-site customer engineersTurn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specificationsDefine test vehicles, alignment-mark requirements and acceptance criteria with customers and EngineeringRun customer demos and evaluations; diagnose overlay, die shift,...

Working Location: Woodlands North Coast Working Days: Monday – Friday Working Hours: 9:00am -6:00pm Starting Salary: $3,000 to $6,000 Responsibilities Lead thedesign, development, optimization, and validationof software and hardware applications for advanced die bonding processes. Analyze customer requirements and translate them into customized...

The role Reports to the BU General Manager Lead applications, process integration, field service and on-site customer engineers Turn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specifications Define test vehicles, alignment-mark requirements and acceptance criteria with customers and Engineering Run customer demos...

Lead applications, process integration, field service and on-site customer engineersTurn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specificationsDefine test vehicles, alignment-mark requirements and acceptance criteria with customers and EngineeringRun customer demos and evaluations; diagnose overlay, die shift,...

Working Location: Woodlands North Coast Working Days: Monday – Friday Working Hours: 9:00am -6:00pm Starting Salary: $3,000 to $6,000 Responsibilities Lead thedesign, development, optimization, and validation of software and hardware applications for advanced die bonding processes. Analyze customer requirements and translate them into customized...

Working Location: Woodlands North Coast Working Days: Monday - Friday Working Hours: 9:00am -6:00pm Starting Salary: $3,000 to $6,000 Responsibilities Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes. Analyze customer requirements and translate them into customized...

The Packaging Engineer is responsible for supporting packaging development and implementation activities for APAC markets, including structural packaging solutions, packaging specifications, system set-up, and project coordination. This role collaborates closely with cross-functional teams, material vendors, Operations, Regulatory, Procurement, Marketing and...

This is Energizer Holdings, Inc. Energizer Holdings responsibly creates products to make lives easier and more enjoyable. To do this, we lean into our culture as an organization - we win together, while serving each other, with a willingness to act boldly, all while doing right. Our colleagues hail from all backgrounds, nationalities and walks of life, but...

THE ROLE:AMD’s Heterogeneous Integration Technology team is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands‑on thermal and mechanical characterization of packaging materials and assemblies with Integrated Voltage Regulator (IVR) thermal and electrical test‑vehicle characterization. The engineer...

THE ROLE:AMD's Heterogeneous Integration Technology team is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands-on thermal and mechanical characterization of packaging materials and assemblies with Integrated Voltage Regulator (IVR) thermal and electrical test-vehicle characterization. The engineer will help...

THE ROLE: AMD’s Heterogeneous Integration Technology team is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands‑on thermal and mechanical characterization of packaging materials and assemblies with Integrated Voltage Regulator (IVR) thermal and electrical test‑vehicle characterization. The engineer...

Working Location: Woodlands North CoastWorking Days: Monday - FridayWorking Hours: 9:00am -6:00pmStarting Salary: $3,000 to $6,000ResponsibilitiesLead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.Analyze customer requirements and translate them into customized semiconductor...

This is Energizer Holdings, Inc. Energizer Holdings responsibly creates products to make lives easier and more enjoyable. To do this, we lean into our culture as an organization – we win together, while serving each other, with a willingness to act boldly, all while doing right. Our colleagues hail from all backgrounds, nationalities and walks of life,...

You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create...