[Semiconductor] Process Manager
4 weeks ago
Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence.
Key Responsibilities- Provide leadership and strategic direction for the bumping engineering team
- Oversee development, optimization, and qualification of 300mm bumping processes
- Execute technology roadmap and stay ahead of industry trends
- Collaborate with manufacturing, quality, equipment engineering, and R&D teams
- Manage personnel, equipment, and budget to meet departmental goals
- Foster innovation and continuous process improvement
- Identify and mitigate process risks to ensure production quality
- Bachelor's in Engineering, Physics, Materials Science, or related field
- 10-12+ years experience in bumping engineering or 300mm wafer processing
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number: D | Licence Number: 10C5117 | EA Registration Number: R
If you would like to be considered for this opportunity, please forward a copy of your full CV to
Seniority level- Mid-Senior level
- Full-time
- Engineering and Production
- Semiconductor Manufacturing
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