
Principal/Senior Engineer, APTD CEM
10 hours ago
Overview Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering. We are seeking an Advanced Packaging Integration Engineer to join Micron’s Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. We pursue innovation for customers and partners with integrity, sustainability, and community support. Micron delivers solutions from VR to AI, memory and storage technologies, and is focused on high performance memory products and transfer to manufacturing. We are currently experiencing a groundbreaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Join a world-class global team focused on enabling high-value technology-driven solutions for customers and partners, driving innovations from development to production. Key responsibilities Technology Development: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes. Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity. Integrate semiconductors while partnering with process and product engineering teams. Yield Improvement: Achieve and improve yields through silicon-package integration innovations. Collect and analyze data to provide actionable outcomes for layout, design, or integration flow changes. Collaborate with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements. Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing. Establish correlations between defense mechanisms to identify improvement opportunities. Conduct continuous data analysis to establish advanced controls and identify improvement opportunities. Collaboration and Coordination: Work with internal and external stakeholders to build and execute technology development strategies aligned with objectives. Coordinate with PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate manufacturing processes for optimal performance and quality control. Ensure smooth transition from new product development to high-volume production. Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities. Requirements B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical Engineering, Physics, Materials, or related field 2+ years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics Experience with Visual Basic for automation and tool integration Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding Strong understanding of process flows and interactions; ability to integrate semiconductors with process and product engineering teams Ability to resolve complex issues through root-cause or model-based problem solving Tenacity to work effectively under timelines and limited resources; proven track record to solve problems and address root causes About Micron Technology We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life. With a focus on customers, technology leadership, and manufacturing excellence, Micron delivers a portfolio of high-performance DRAM, NAND, and NOR memory and storage products through Micron and Crucial brands. Our innovations fuel the data economy and enable advances in AI and 5G across data centers, intelligent edge, and client/mobile experiences. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. For assistance with the application process or reasonable accommodations, contact Micron prohibits child labor and complies with applicable laws and standards. Micron does not charge candidates recruitment fees or request unlawful payments. AI and fraud notices: use of AI tools should reflect true skills and experiences; misrepresentation may lead to disqualification. Verify communications claiming to be from Micron on the official Micron careers site. Seniority level Mid-Senior level Employment type Full-time Job function Other Industries: Computer Hardware Manufacturing, Appliances, Electrical and Electronics Manufacturing, Semiconductor Manufacturing #J-18808-Ljbffr
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Principal/Senior Engineer, APTD CEM
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Singapur, Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...