Research Associate

5 days ago


Singapore Nanyang Technological University Singapore Full time
Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Join to apply for the Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design) role at Nanyang Technological University Singapore

Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

4 months ago Be among the first 25 applicants

Join to apply for the Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design) role at Nanyang Technological University Singapore

Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.
Key Responsibilities

  • Design compact mechanical housing to operate under 250°C ambient conditions.
  • Ensure internal core temperature remains under 55°C during runtime.
  • Select and integrate miniaturized components (compute, battery, sensors).
  • Strip sensor casings and reassemble into a custom mount with thermal shielding.
  • Perform heat simulation, thermal insulation, and shock-resistance design.
  • Test hardware in specified sites and environments.
Job Requirements
  • Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.
  • Strong experience in heat-resistant enclosure design and miniaturized hardware integration.
  • Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).
  • Experience with IP65/ IP67 standards, fanless computing, and embedded design.
  • Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus.
Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics
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