Senior Staff, Packaging Engineer

3 weeks ago

Singapur, Singapore Advanced Micro Devices Full time

Overview

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

AMD together we advance_

The Person

Our ideal candidate is an experienced Package Layout or Silicon Physical Layout Engineer with excellent communication & project management skills and can complete the design task with the least supervision. He/she must be able to work on a fast phase environment and collaborate well with others.

Key Responsibilities
  • Codesign with Signal/Power Integrity and PCB design team to complete a substrate layout that will meet the design objectives for performance, cost and quality.
  • Support substrate design for probe card substrate, test chips and test vehicles for technology development.
  • Codesign with SOC team to complete Bump matrix and Interposer design for 3D,2.5D, COWOS and other advanced packaging technologies (Chiplet).
  • Contribute to the development and enhancements of processes and methodologies to improve design efficiency.
  • Interact with Assembly houses and substrate vendors to achieve cost-efficient and high-quality design.
  • Mentor Junior Colleagues to enhance layout practices.
Preferred Experience
  • Minimum 8 years’ experience in designing complex substrate design or Silicon Interposers.
  • Very good understanding of Signal Integrity and power integrity principles.
  • Knowledge of using CAD Layout tools such as Cadence SIP, APD, Synopsys 3DICC, First Encounter, ICC2 or other Packaging or Silicon Physical Layout Software.
  • Knowledge of Python, TCL, Perl or Skill Script Programming is a plus.
  • Experience dealing with assembly, foundry, and substrate vendors.
Academic Credentials
  • B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science
Location

Singapore

#LI-HR1

#LI-HYBRID

Benefits

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

#J-18808-Ljbffr

  • Senior Mechanical Engineer

    3 days ago

    Singapur, Singapore Hanwha Ocean Full time

    Senior Mechanical Engineer - Package Equipment Join us at Hanwha Ocean as a Senior Mechanical Engineer - Package Equipment . Position Overview The Senior Mechanical Package Engineer in the Topsides Mechanical Equipment Discipline is responsible for leading complex engineering projects, providing technical guidance, developing innovative solutions, and...

  • Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

    3 weeks ago

    Singapur, Singapore Micron Technology Full time

    Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...

  • Principal/Senior/ Engineer, Advanced Packaging Integration Engineering

    3 weeks ago

    Singapur, Singapore Micron Technology Full time

    Principal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer,...

  • MTS Advanced Packaging Lithography Process Engineering

    3 weeks ago

    Singapur, Singapore GlobalFoundries Full time

    MTS Advanced Packaging Lithography Process Engineering Join to apply for the MTS Advanced Packaging Lithography Process Engineering role at GlobalFoundries MTS Advanced Packaging Lithography Process Engineering 6 days ago Be among the first 25 applicants Join to apply for the MTS Advanced Packaging Lithography Process Engineering role at GlobalFoundries ...

  • Package Engineer

    3 weeks ago

    Singapur, Singapore Seatrium Full time

    Join to apply for the Package Engineer (Expeditor) role at Seatrium Join to apply for the Package Engineer (Expeditor) role at Seatrium Responsible for managing equipment packages from pre-purchase to final delivery, ensuring compliance with project and contractual requirements. Key tasks include coordinating with buyers to finalize POs, monitoring...

  • Senior/Staff/Principal Engineer

    3 weeks ago

    Singapur, Singapore Canonical Full time

    Join to apply for the Senior/Staff/Principal Engineer role at Canonical 3 days ago Be among the first 25 applicants Join to apply for the Senior/Staff/Principal Engineer role at Canonical Get AI-powered advice on this job and more exclusive features. Canonical is a leading provider of open source software and operating systems to the global enterprise...

  • Senior/Engineer, Advanced Packaging Integration

    3 weeks ago

    Singapur, Singapore Micron Technology, Inc Full time

    Senior/Engineer, Advanced Packaging Integration - Assembly page is loadedSenior/Engineer, Advanced Packaging Integration - Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted 8 Days Ago job requisition id JR76660Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate...

  • Member of Technical Staff

    3 weeks ago

    Singapur, Singapore Micron Technology Full time

    Overview Member of Technical Staff / Principal Product Engineer (Package PE) at Micron Technology. As the MTS / Principal Product Engineer (Package PE), you will lead a top-performing team focusing on Package and HBM Product engineering within the HBM Product and System Engineering Team. Responsibilities Cumulative Yield Ownership: Lead initiatives...

  • Senior Director, HBM Packaging

    3 weeks ago

    Singapur, Singapore Micron Technology Full time

    Join to apply for the Senior Director, HBM Packaging role at Micron Technology Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual...

  • Senior Staff Engineer, Computer Vision

    3 weeks ago

    Singapur, Singapore OKX Full time

    Join to apply for the Senior Staff Engineer, Computer Vision role at OKX 2 weeks ago Be among the first 25 applicants Join to apply for the Senior Staff Engineer, Computer Vision role at OKX Get AI-powered advice on this job and more exclusive features. OKX will be prioritising applicants who have a current right to work in Singapore, and do not...