
Engineer - Test Process (WLCSP)
2 weeks ago
Responsibilities
- Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
- Monitor and improve device yield performance and process SPC charts.
- Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots.
- Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
- Implement continuous improvement program (CIP) to support yield and cost improvement.
- Facilitate training of manufacturing personnel on operating procedures and process specification.
- Work closely with inter-department to improve process and equipment performance and capability.
- Coordinate and communicate with customers for any process engineering related matters.
Requirements
- Diploma / Degree in any Engineering Discipline
- Minimum 3 years working experience in semiconductor assembly manufacturing.
- Working knowledge in process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage.
- Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
- Experience in customer and supplier engagement
- Know-how in process definition, qualification, optimization, equipment operation and buyoff.
- Ability to work on ad-hoc projects in process and equipment.
- Supports both equipment and process engineering activity.
- Working hours: 9pm to 6am
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