Chip to Wafer Bonding Senior Research Scientist

2 weeks ago

Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications.Job Description: Process Development and Optimization Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods. Investigate and refine related processes like wafer cleaning, planarization (CMP), and post-bonding annealing, addressing critical factors such as warpage, bonding strength, and alignment accuracy. Evaluation and Characterization Plan and execute comprehensive evaluations of processes, materials, and equipment. Conduct experiments for process characterization, data collection, and analysis to drive quality improvements. Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications like AI accelerators and 3D-ICs. Project Collaboration and Integration Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects. Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next-generation capabilities. Documentation and Intellectual Property Generate detailed engineering reports, research papers, and technical documents. Contribute to the creation of new intellectual properties (IPs), file patents, and document know-how related to heterogeneous integration platforms. Publish research findings in prestigious scientific journals and present at conferences. Mentorship and Expertise Act as a subject matter expert (SME) for both internal and external stakeholders. Mentor and inspire scientists, engineers and talents in the field of advanced semiconductor packaging technology. Job Requirements: PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. Experience in chip to wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage. Relevant experience in semiconductor packaging or process development.

  • Chip to Wafer Bonding Principal Scientist

    4 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding...

  • W2W Bonding Senior Research Scientist

    2 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.Job Description: Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

  • 6723 - Advanced Packaging Process Engineer - Laser Bonding | Semiconductor | LAB, DOE, SPC, 2.5D Integration

    2 weeks ago

    Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Laser-Assisted Bonder (LAB) process engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes-especially in high-precision, high-reliability Advanced Packaging application for...

  • TCB Design Engineer

    2 weeks ago

    Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

  • Semiconductor Packaging Module Design Engineer

    2 weeks ago

    Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Semiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...

  • Research Associate

    2 weeks ago

    Singapur, Singapore NATIONAL UNIVERSITY OF SINGAPORE Full time

    Interested applicants are invited to apply directly at the NUS Career Portal Your application will be processed only if you apply via NUS Career Portal We regret that only shortlisted candidates will be notified.Job Description The National University of Singapore invites applications for the position of Research Associate in the Department of Computer...

  • Research Fellow/Research Scientist

    2 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    The lab of RNA in Disease and Translational Technologies at the Institute of Molecular and Cell Biology, A*STAR, Singapore is seeking to recruit a highly motivated Postdoctoral Research Fellow/Scientist or Senior Postdoctoral Research Fellow/Scientist to join a team developing a ribozyme-based RNA platform for therapeutic applications (including neurological...

  • Senior Research Scientist

    2 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    A*STAR Centre for Frontier AI Research (A*STAR CFAR) seeks highly motivated scientists with talents and inclination to conduct cutting-edge research, develop and execute research strategies in Safe and Trustworthy AI.Successful candidates will be responsible, but not limited to:Job Responsibilities: Work with AI scientists in A*STAR CFAR to develop Safe and...

  • Research Scientist

    2 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    The HY Lab is dedicated to advancing innovative cancer therapies, with a strong focus on translational research targeting cancer-specific mutations. Supported by major national and industry-aligned programs, our mission is to accelerate platform development and clinical translation. Our research spans antibody discovery and engineering, bispecific antibody...

  • (Senior) Research Scientist, Cybersecurity, I2R

    2 weeks ago

    Singapur, Singapore A*STAR RESEARCH ENTITIES Full time

    We are looking for a highly-motivated research scientist to work on exciting projects in Cybersecurity (AI for Cybersecurity). Need Strong programming skills and familiarity with Cybersecurity and Artificial Intelligence. Successful candidates will have the opportunity to work with a worldclass interdisciplinary team comprising malware, networking,...