6723 - Advanced Packaging Process Engineer - Laser Bonding | Semiconductor | LAB, DOE, SPC, 2.5D Integration

Position title : Laser-Assisted Bonder (LAB) process engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes-especially in high-precision, high-reliability Advanced...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration.Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

Micron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to...

A leading semiconductor company in Singapore is seeking an Advanced Packaging Integration Engineer to develop cutting-edge packaging technologies. This role involves improving product quality, yield, and productivity through data analysis and collaboration with various engineering teams. The ideal candidate has relevant education and experience in...

Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.Job Description: Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

Overview Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering. We are seeking an Advanced Packaging Integration Engineer to join Micron’s Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. We pursue innovation for customers and partners with...

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to...

Key Responsibilities Own MEMS process integration for both new device development and sustaining production, spanning concept, prototyping, pilot, and mass production phases. Translate MEMS device designs into scalable, manufacturable process flows, with an emphasis on design-for-manufacturability and innovation. Drive R&D of novel materials, unit processes,...

A leading semiconductor company in Singapore is seeking an Advanced Packaging Integration Engineer to develop innovative packaging technologies. The role involves improving product quality, driving yield enhancements, and collaborating with various engineering teams. Candidates should have 2+ years of semiconductor integration experience and proficiency in...

School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic standards and research. With over 3,000 undergraduates students and 2,000 graduate students it is one of the largest EEE schools in the world and ranks 4th in...