TCB (Thermo Compression Bonding) Process Engineer

4 days ago

Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

Overview

Position title: TCB (Thermo Compression Bonding) Process Engineer

Location: North

Working Days: 5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: $5000 - $8000 (depends experience)

Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

LIEW ONN KEE REG NO : R

THE SUPREME HR ADVISORY EA NO:14C7279

Responsibilities
  • Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
  • Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
  • Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
  • Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
  • Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
  • Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
  • Support NPI (New Product Introduction) and technology transfers from R&D to production.
  • Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
  • Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
  • Maintain compliance with environmental, health, and safety standards.
  • Experience on HBM, COWOS, 2.5D is a definite plus
  • Experience on N2 Environment is added advantage
Qualifications
  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
  • Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.
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