Advanced Packaging Design Engineer – Thermo-Compression Bonding Systems

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development

• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).

• Planning, Scheduling and Costing of Machines Modules.

• Prototyping & Testing

• Oversee fabrication of prototype modules and their integration with TCB platforms.

• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

• Process & Manufacturing Support

• Collaborate with Electrical, Vision and Software Engineers for the machine integration.

• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)

• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

• Compliance & Documentation

• Document all designs, simulations, and test results according to quality management and IP standards.

• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis

• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.

• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.

• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.

• Experience with TCB or Laser Assisted bonding technologies is highly preferred.

• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.

• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279