TCB Senior Engineer – Thermo-Mechanical Simulation
2 weeks ago
TCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Admiralty. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $4000 - $8000 (depends experience). Overview We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding . This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products. Responsibilities Thermo-Mechanical Simulation & Modelling — Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation. Thermo-mechanical stress and strain analysis — Perform analyses to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers). Thermal flow and heat distribution — Model and analyze thermal flow within the package during Thermocompression bonding and other thermal processes. Thermal Flow & Process Interaction — Simulate and optimize thermal transfer efficiency during bonding to minimize die stress and void formation. Evaluate and recommend process parameters for improved bond uniformity and reliability . Work with process and materials engineers to correlate simulation results with empirical bonding performance . Cross-Functional Collaboration — Collaborate with package design , materials , and process development teams to identify design improvements. Support failure analysis activities through root-cause investigation based on thermal and mechanical simulation. Reporting & Documentation — Prepare detailed technical reports, simulation summaries, and presentations. Document modelling assumptions, boundary conditions, and validation processes. Requirements M.S. or Ph.D. in Mechanical Engineering , Materials Science , or a related discipline. 5+ years of hands-on experience in thermo-mechanical simulation for semiconductor packaging or advanced electronics. Proficiency with finite element tools such as ANSYS, Abaqus, COMSOL , or equivalent. Strong understanding of package-level thermal and mechanical behaviour , including CTE mismatch , warpage mechanics , and thermal cycling effects . Experience with Thermocompression bonding processes, thermal interface materials (TIMs) , and underfill dynamics . Knowledge of wafer-level packaging (WLP) , fan-out , or heterogeneous integration . Experience in DOE (Design of Experiments) and statistical correlation between modelling and experimental data. Familiarity with material property characterization (CTE, modulus, Tg, etc.) relevant to packaging simulation. Interested applicants to contact via WA their resume to + 9*** or email to **************@gmail.com. Note: The following company and regulatory lines have been omitted from this refined version to maintain focus on the job responsibilities and qualifications. #J-18808-Ljbffr
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Senior Engineer
2 weeks ago
Singapur, Singapore The Supreme HR Advisory Full timePosition title: Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: SembawangWorking Days: 5 Day A WeekWorking hours: 9:00am - 6:00pmSalary: $4000 - $8000 (depends experience) Overview We are seeking a highly skilled engineer to join our advanced semiconductor packaging team. The ideal candidate will specialize in...
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Senior Engineer
3 weeks ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title: Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Sembawang Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $4000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be...
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Senior Engineer
2 weeks ago
Singapur, Singapore The Supreme HR Advisory Full timePosition Title Senior Engineer – Thermo‑Mechanical Simulation (Semiconductor Packaging) Location & Working Hours Sembawang • 5 Day A Week • 9:00am – 6:00pm Salary $4,000 – $8,000 (depends on experience) Contact Recruiter: Ms Lynne – WA: No charges will be incurred by candidates for any service rendered. Legal Notices TAN LEE XIAN Reg No: R The...
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