Senior Engineer

2 weeks ago

Singapur, Singapore The Supreme HR Advisory Full time

Position Title Senior Engineer – Thermo‑Mechanical Simulation (Semiconductor Packaging) Location & Working Hours Sembawang • 5 Day A Week • 9:00am – 6:00pm Salary $4,000 – $8,000 (depends on experience) Contact Recruiter: Ms Lynne – WA: No charges will be incurred by candidates for any service rendered. Legal Notices TAN LEE XIAN Reg No: R The Supreme HR Advisory Pte Ltd EA No: 14C7279 Overview We are seeking a highly skilled engineer to join our advanced semiconductor packaging team. The ideal candidate will specialize in thermo‑mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding. This role will involve close collaboration with cross‑functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next‑generation semiconductor products. Key Responsibilities Thermo‑Mechanical Simulation & Modelling Develop and execute detailed FEA models to predict package warpage during assembly, reflow, and operation. Perform thermo‑mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, large interposers). Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes. Thermal Flow & Process Interaction Simulate and optimize thermal transfer efficiency during bonding to minimize die stress and void formation. Evaluate and recommend process parameters for improved bond uniformity and reliability. Work with process and materials engineers to correlate simulation results with empirical bonding performance. Cross‑Functional Collaboration Collaborate with package design, materials, and process development teams to identify design improvements. Support failure analysis activities through root‑cause investigation based on thermal and mechanical simulation. Provide simulation insights to guide material selection (underfill, die attach, interposer, substrate, etc.). Reporting & Documentation Prepare detailed technical reports, simulation summaries, and presentations. Document modelling assumptions, boundary conditions, and validation processes. Requirements M.S. or Ph.D. in Mechanical Engineering, Materials Science, or a related discipline. 5+ years of hands‑on experience in thermo‑mechanical simulation for semiconductor packaging or advanced electronics. Proficiency with finite element tools such as ANSYS, Abaqus, COMSOL, or equivalent. Strong understanding of package‑level thermal and mechanical behaviour, including CTE mismatch, warpage mechanics, and thermal cycling effects. Experience with Thermocompression bonding processes, thermal interface materials (TIMs), and underfill dynamics. Knowledge of wafer‑level packaging (WLP), fan‑out, or heterogeneous integration. Experience in DOE (Design of Experiments) and statistical correlation between modelling and experimental data. Familiarity with material property characterization (CTE, modulus, Tg, etc.) relevant to packaging simulation. #J-18808-Ljbffr

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