TCB Design Engineer( Die Ejection
17 hours ago
Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.TAN LEE XIAN Reg No: R The Supreme HR Advisory Pte Ltd EA No: 14C7279Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage. Key Responsibilities Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm). Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection. Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis. Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape. Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up. Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput. Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications. Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection. Analyze yield loss due to ejection-related defects and implement design or process improvements. Support cross-functional teams in root-cause analysis and failure prevention. Requirements Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field. 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems. Strong background in mechanical stress analysis, warpage modeling, and precision tooling design. Proficiency with SolidWorks, Creo, or equivalent 3D CAD software. Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis. Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages. Prior involvement in CoWoS, 2.5D, or HBM packaging processes. Hands-on experience with tape residue management, die pick-up optimization, or die attach automation. Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques. Experience collaborating with process, electrical, and software teams in semiconductor tool development.
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TCB Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
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Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty StreeWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewWe are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging...
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TCB Semiconductor Packaging Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...
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TCB Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen...
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TCB Design Engineer
17 hours ago
Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges...
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Singapur, Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewThe Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal...
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Singapur, Singapore The Supreme HR Advisory Full timeTCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Admiralty. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $4000 - $8000 (depends experience). Overview We are seeking an engineer to join our advanced...
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Singapur, Singapore CAPCON SINGAPORE PTE. LTD. Full timeCompany Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...
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Senior Engineer Die Bank
2 weeks ago
Singapur, Singapore Infineon Technologies Full timeOverview Join to apply for the Senior Engineer Die Bank role at Infineon Technologies . We are looking for a senior engineer in the OSAT die bank department to oversee and establish processes and procedures for the improvement and control of the quality of products. In your new role you will To establish a system in developing, sustenance and improvement of...
