CMP Process Master
2 weeks ago
Job Responsibilities Process Development & Optimization Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. Process Integration Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies. Data Analysis & Documentation Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Document standard operating procedures (SOPs), work instructions, and control plans. Cross-Functional Collaboration Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). Assist with customer qualifications and reliability testing as needed. Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.Job Requirements Professional Qualifications: PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field. 5-10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing. Hands-on experience with CMP tools. Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding. Specialized Knowledge & Skills: Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes. Strong analytical, documentation, and problem-solving skills. Good communication and teamwork in a cross-functional environment.
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CMP Process Master
2 weeks ago
Singapur, Singapore ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. Full timeJob Responsibilities Process Development & Optimization Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling...
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CMP Manager
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Senior / Principal Process Engineer (TF-CMP/CVD)
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Senior / Principal Process Engineer (TF-CMP/CVD)
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ENGINEER - PEE CMP
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Singapur, Singapore Micron Technology Full timeJoin to apply for the ENGINEER - PEE CMP role at Micron Technology . 5 days ago Be among the first 25 applicants. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help...
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Coating Process Master
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Scrum Master
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Singapur, Singapore NTT Communications Full timeMake an impact with NTT DATA Join a company that is pushing the boundaries of what is possible. We are renowned for our technical excellence and leading innovations, and for making a difference to our clients and society. Our workplace embraces diversity and inclusion – it’s a place where you can grow, belong and thrive. Your day at NTT DATA The Scrum...
