SENIOR/ENGINEER, NAND wafer level product reliability and design
7 months ago
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR53282 SENIOR/ENGINEER, NAND wafer level product reliability and designOur vision is to transform how the world uses information to enrich life forall.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Non-Volatile Engineering (NVEG) Product Engineer at Micron Technology Inc, you will be responsible for driving an effort to accelerate NAND development learning cycles to achieve best in class cycle time from first silicon to qualified system. Additionally, you will work with various Engineering and Development groups to ensure necessary actions are taken to meet NAND defectivity(DPM) and reliability product requirements. You will be engaged in developing, validating, characterizing, and qualifying Micron’s next generation 3D NAND memory products to power our customers’ innovation. The future of non-volatile memory and the systems that utilize the advanced technology will continue to be exciting and dynamic. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.Responsibilities include, but not limited to: Responsible and accountable for reducing NAND defectivity(DPPM) to enable qualification of world class end products (Mobile, Consumer SSD, Enterprise SSD) Perform electrical failure analysis(EFA) to solve technical problems using lab tools and techniques Develop short term counter measures in form of stresses/screens by exercising Digital and Analog Circuit, Device Physics, Process Engineering knowledge Drive Physical Failure Analysis (PFA) and Root Cause Analysis and long-term countermeasures with global organizations Collaborate with Fab, NAND Technology Development, NAND Design, NAND Product Development, System Development and Quality/Reliability team to develop and ship end products Perform NAND Usage Case Modeling Evaluations (Based on Product Used Cases) Drive System Countermeasures with Firmware Teams to prevent residual failure exposure for the customer Employ data analytical skills for high volume data analysis Develop new Design for Test and Design Modes as a solution to new challenges. Minimum Qualifications: Master's Degree in Electrical Engineering OR Bachelor's Degree in Electrical Engineering Excellent understanding of NAND Flash Device Physics, NAND Design is required Good understanding of NAND-System Integration is required Knowledge of NAND Process Engineering is preferred Experience using schematic tools, Verilog simulation, micro probing is preferred Knowledge of Programming Languages such as Python/C/C++ is required Effective communication skills in written and spoken English Good multitasking skills and ability to set priorities in a fast moving, dynamic environment Excellent problem solving and analytical skills Self-motivation and enthusiasm-
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