Reliability Engineer 1

2 weeks ago

Singapore Advanced Micro Devices, Inc. Full time

**What you do at AMD changes everything**

At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Reliability Engineer (FEA)

The Role:

- Join a global package reliability team that drives component and board-level reliability activities across AMD’s 3nm/5nm IC and graphics-card products that employ advanced flipchip and chiplet package constructions. Collaborate with colleagues across AMD Global Operations, business units and a worldwide external supply base. Take on individual responsibility to lead development and implementation of package reliability computational methodologies and evaluations.
- AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology

The Person:

- A problem solver, with demonstrated track record of meeting complex technical challenges and devising innovative solutions using depth and breadth of knowledge in thermo-mechanical behavior of materials, composite structures, and finite element analysis (FEA).

Key Responsibilities:

- Starting at early product development stages, establish comprehensive FEA plans and modelling methodologies to assess package and board-level reliability under a variety of process, thermal, mechanical, moisture and end-use conditions.
- Take leadership of comprehensive package reliability FEA activities for IC and graphics-card products throughout concept, development, qualification, production-ramp and sustaining.
- Establish material characterization best-known-methods and database for simulation, leveraging in-house lab capabilities and external resources.

Preferred Experience:

- 0-3 years professional experience required.
- Proficiency in finite element analysis modelling using ANSYS (or equivalent) is required.
- Knowledge of semiconductor packaging materials and constructions is preferred.
- Knowledge of circuit board materials, assembly, and sockets/connectors is preferred.
- Strong written and oral communication skills, including comprehensive technical reports, are required.
- Ability to thrive as a team player in a diverse, multi-national organization is required.
- Familiarity with JMP and MATLAB is helpful.

Academic credentials:

- BS, Masters or PhD in Mechanical Engineering, Materials Science, Chemistry, Physics, or Computer Science.

**Location**:

- Singapore

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV

LI-SY1

**Requisition Number**:143644
**Country/Region/Location**:Singapore **State/Province**:Singapore **City**:Singapore
**Job Function**:Reliability & Test

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