Senior Mts Td Integration Engineering

4 days ago

Singapore GLOBALFOUNDRIES Full time

**About GlobalFoundries**

**Introduction**

You will be responsible in driving 3DIC Heterogeneous Integration technology development through various maturity milestones (from proof-of-concept to ready-for-production) by meeting the requirements for electrical, mechanical, thermal, reliability, and customer specifications and contribute to GlobalFoundries corporate objective to be the leader in providing feature-rich solution to customers. You will also guide, train, and supervise engineers in making decisions to resolve issues.

**Your Job**
- Ability to lead, plan and establish integration scheme to meet technology electrical performance requirement and customer’s requirements for project success to production ramp
- Drive and coordinate engineering activities and experiments for the Heterogeneous Integration project technology qualification to ramp production
- Optimize and establish process integration scheme to meet wafer hybrid bond technology requirements
- Characterization of 3D Heterogeneous Integration process to guide process development and to give a clear instruction and direction to engineers, support teams, based on good technical judgment
- Good team player to collaborate with cross-sites Fab/TD development partners, process engineers, modelers, circuit designers and customers to ensure project success delivery
- Good technical presentation skill for customer and discuss with cross functional team.
- Successful experience in 3D IC Heterogeneous Integration and packaging technology
- Ability to translate customer/marketing requirements of yield, reliability, and performance into process integration deliverables for successful technology delivery to production technical specs
- Lead working meetings and find solutions to process integration issues
- Consistent external publications or recognized expert in Heterogeneous Integration area

**Required Qualifications**:

- PhD / Masters /Degree in Electrical / Electronics / Physics/ Material Science / other engineering
- At least 13 years’ experience in 3D Heterogeneous integration, and management but not limited to
- Knowledge and experience in IC fabrication, hybrid wafer bonding, ISP, Sensor related, and eNVM a plus
- Customer engagement for product
- Process device and module experience would be an added advantage and desirable
- Strong leadership qualities.
- Good communication skills with an open attitude as team player
- Strong technical knowledge and good decision-making skills
- Excellent analytical and optimization skills
- Coach engineers in advance skills and manage with trust and respect

**Preferred Qualifications**:

- Education: PhD in Electrical / Electronic Engineering with a dissertation on ISP, SENSOR-related esp. SPAD, Photodiode, and Hybrid Wafer Bonding knowledge
- Field of specialization: Optoelectronics

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

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