Packaging Engineer

7 days ago

Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. **Together, we advance your career.**

**Responsibilities**:
**THE ROLE**:
Lead experimental validation and characterization of advanced packaging solutions such as 2.5D/3D, CPO, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities.

**THE PERSON**:
**KEY RESPONSIBILITIES**:

- **Establish Packaging Lab Capabilities**:to drive experimental validation and characterization of advanced packaging solutions such as 2.5D/EFB/CoWoS/WLFO, CPO, CoW/WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies.
- **Lead Data Collection & Analysis**:efforts, collaborating with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities).
- **Drive Technology & Product Roadmap Enablement**:define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps.
- **Cultivate Strategic Partnerships**:develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources.
- **Provide Technical Leadership**: provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians.

**PREFERRED EXPERIENCES**:

- 10+ years of experience in packaging, metrology, characterization, design validation of components, packages and platforms.
- Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moire, x-ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC-MS).
- Experience with data collection and analysis, including statistical methods.
- Demonstrated ability to work independently and in a team environment.

**ACADEMIC CREDENTIALS**:
Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent.

**LOCATION**:
Singapore

LI-JV1

Qualifications:
_ Benefits offered are described: _AMD benefits at a glance_._

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