Principal/senior Engineer, Advanced Packaging Integration Engineering

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key responsibilities and duties include:
Technology Development:

- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Integrate semiconductors while partnering with process and product engineering teams

Yield Improvement:

- Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Quality Improvement:

- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

- Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

**Requirements**:

- B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
- 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
- Ability to resolve complex issues through root-cause or model-based problem solving
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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