Senior Manager/ Manager, Advanced Packaging Technology Development

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

**Micron’s vision is to transform how the world uses information to enrich life**_for all_**.**Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for a Sr Manager/Manager to join our Advanced Packaging Technology Development (APTD) team

You will lead the package integration department to enable deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects.

**Key responsibilities and duties include**:
Develop and Communicate Advanced Packaging Technology Development Strategy
- Develop and communicate Advanced Packaging Technology Development strategic objectives
- Understand the impact and implications of APTD strategy to the overall company strategy and direction

Technical Leadership
- Set fiscal year technical objectives and insure they are aligned with department objectives
- Demonstrate understanding of technology complexity and effective technology decision making
- Provide technical leadership that may influence company direction

Multi-Functional Leadership
- Represent APTD in providing cross department leadership in area of responsibility
- Work effectively with peers in other department to develop and drive multi-functional initiatives

Impact and Execution
- Ensure accuracy, quality, and timeliness of results
- Guide best utilization of resources to achieve end results
- Ensure critical work, milestones and goals are met by the team

Growth Mindset
- Continue to build new skills through development goals and learning events.
- Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Training and Development:

- Conduct performance appraisals with team members to create goals and development plans
- Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology

**Requirements**:

- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions
- Strong understanding of process flows, process interactions, and how process changes can affect yield, perform