Die Attach

1 week ago

Singapore MEDS TECHNOLOGIES PTE LTD Full time

Setup and operate assembly equipment for epoxy dispensing, die attach, wire bonding, plasma cleaning, epoxy curing, pull/shear testing, leak testing, etc.
- Execute Design of Experiments (DOEs) to develop new assembly processes or improve existing ones.
- Provide input to engineering teams on the producibility of new designs.
- Help develop assembly instructions and method sheets.
- Help define assembly tooling/fixturing requirements and support the assembly design.
- Troubleshoot equipment and process issues.
- Help research and procure special tooling/equipment for use in assembly operations.
- Provide regular progress reports to department head and program teams.
- Perform microelectronics IC device assembly according to work instructions, assembly drawings and specifications
- To manufacture products in accordance with MEDs technologies quality standards
- Consistently complete quality work in a timely manner meeting established deadline
- To support engineers to enhance microelectronics assembly yield and device reliability

**Requirements**:

- Diploma/ITE Electronics or equivalent
- Minimum five (5) years of experience in microelectronic assembly operations
- Demonstrated, hands-on experience in epoxy dispense, die attach, wire bonding (thermo-compression bonding) including setup, operation and troubleshooting of the associated equipment
- Hands on experience in wire bonder and die attach is preferable
- Comfortable working with incomplete information and exploring new, unconventional microelectronic packaging processes and technologies
- Demonstrated experience in executing DOEs with utmost attention to detail and accurate recording of data
- Excellent hand-eye coordination and the ability to work in a clean room environment with the aid of microscopes for extended periods of time
- Good diagnostic skills in troubleshooting process and equipment problems.

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