Die Attach

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...

Position title : Production Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $3500 - $4000 (depends experience)Responsibilities: Performs machine and process setup of die attach and moulding machines Able to performs machine troubleshooting. Performs mechanical alignment Ensure that the quality product is...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...

**Responsibilities**: - Assemble semiconductor PKGs with silver conductive paste according to the customer's request and feedback on the results. - Optimize die attach process parameters for PKG assembly. - Support to analyse the failure of yield loss in the die attach process to improve customer productivity. - Develop the die attach & clip attach...

Be part of Die Bond Unit Process Development as Staff/Senior Staff Engineer - Front of Line Die Attach to develop and qualify the new assembly packages, process and ensure meeting design to cost & design manufacturing In your new role you will: - Be part of **Die Bond **Unit Process Development as Staff/Senior Staff Engineer - **Front of Line Die Attach...

Key Job responsibilities - Performs machine & process setup - Perform Troubleshooting and maintenance of wire bonder and die attach machines - Maintain a good machine Uptime - Ensure that he quality product is manufactured on schedule within the customer’s requirement - Work with Cross functional Departments to resolve safety, quality and productivity...

Summary To support R&D activities for 2.5D wafer-level packaging (WLP) processes including Die Preparation, Chip Attach, and Mold focusing on process reliability, manufacturability, and integration for advanced semiconductor packages. Job Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation – grinding, laser grooving, dicing saw;...

**Job responsibilities** - Provide support for Process Engineers on NPI/NPQ product trials - Support Engineers to create process parameters and run DOE trials for new product development - Support Process engineers on the safe launch/pilot run when new products are launched in the production phase - Support to collect data and information related to NPI/NPQ,...