Scientist (Process Integration) (Hi), Ime

Key Responsibilities
Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
Lead high impact projects with manageable risks and mentor less experienced colleagues.
Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
Optimize die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
Conduct engineering experiments for process characterization to drive quality and yield improvements.
Perform reliability characterization of hybrid-bonded packages to ensure robustness and long-term performance.
Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
Work with mínimal supervision and should be a team player.
Qualifications and Skills
**Educational Background**: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
**Technical Expertise**: knowledge in hybrid bonding or flip chip bonding is plus.
**Knowledge**: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable.
**Skills**: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
Excellent written and verbal communication abilities.
**Teamwork**: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
Proven ability to troubleshoot and resolve process-related challenges.
What We Offer
The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
A collaborative and interdisciplinary work environment.
Access to state-of-the-art facilities and resources.
File intellectual property (IP) promptly for new research findings.
Publish research in peer-reviewed journals and present findings at international conferences.
Additional Information
**Application Process**: Interested applicants should submit a detailed resume, a cover letter outlining their qualifications and experience, and contact information for three professional references. Applications can be submitted through the IME career portal.
**Research Environment at IME**: IME provides a dynamic and collaborative research environment, equipped with state-of-the-art 300mm Fabrication facilities and resources. Researchers have access to advanced laboratories and characterisation equipment, fostering innovation and enabling the development of groundbreaking technologies. The institute encourages interdisciplinary collaboration and offers opportunities for professional growth and development.
**Specific Projects**: The Principal Scientist will be involved in several high-impact projects, including the development of next-generation 2.5D and 3D packaging technologies, enhancing hybrid bonding processes for improved performance and reliability, and contributing to industry-leading research in heterogeneous integration. Specific projects may include collaborations with leading semiconductor companies and academic institutions.
**Type of Employment**: Full-Time
**Work Location**: Science Park