Director, Advanced Packaging Technology Development

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key responsibilities and duties include:

- Develop and Communicate Advanced Packaging Technology Development Strategy:

- Develop and communicate Advanced Packaging Technology Development strategic objectives
- Understand the impact and implications of APTD strategy to the overall company strategy and direction
- Technical Leadership:

- Set strategic and long-term technical objectives and insure they are aligned with department objectives
- Demonstrate understanding of technology complexity and effective technology decision making
- Provide technical leadership that may influence company direction
- Multi-functional Leadership:

- Represent APTD in providing cross department leadership in area of responsibility
- Work effectively with peers in other department to develop and drive multi-functional initiatives
- Impact and Execution:

- Ensure accuracy, quality, and timeliness of results
- Guide best utilization of resources to achieve end results
- Ensure critical results, milestones and goals are met by the team
- Provide recommendations to achieve organization objectives and align group to support department objectives.
- Make decisions that directly impact the achievement of work unit and sub-function objectives
- Growth Mindset:

- Continue to build new skills through development goals and learning events.
- Seek out opportunities to work multi-functionally, build a network, and gain competency across domains
- Leadership Development:

- Mentor, develop and motivate leaders and team members
- Cultivate effective team and leadership abilities

Education and Experience:

- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 10 or more years of semiconductor process or equipment development experience, preferably in wafer bonding, plating, warpage control and packaging field
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Ability to use extensive technical knowledge to guide strategic directions
- Consistent track record to solve problems and address root causes
- Tenacity to work effectively under timelines and limited resources
- Validated ability to lead small and large teams, directly or indirectly, toward common goals
- Outstanding communication and presentation skills, written and verbal to all levels of an organization

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.