Project Manager – Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

APTD Project Manager will lead and coordinate strategic project initiatives across the Advanced Packaging & Technology Development organization. This role is responsible for establishing and maintaining project governance, driving operational excellence, and ensuring alignment with APTD's charter to accelerate yield maturity and technology transfer and future packaging innovations.

• Manage full lifecycle of APTD programs including planning, execution, monitoring, and closure.
• Define project missions, objectives, key deliverables, and resource requirements.
• Lead cross-functional teams across PDE, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives.

• Develop and implement standardized PMO methodologies, tools, and templates.
• Own CapEx and OpEx planning, PTM and MOR management, and BOP design systems integration.
• Ensure compliance with internal governance models and external customer requirements. 

• Align project goals with APTD's mission to embed analytics and simulation into development workflows.
• Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams.
• Provide regular updates to leadership on project status, risks, and mitigation strategies. 

• Develop and track KPIs for project success, yield reporting, and EOL accountability.
• Conduct project reviews to assess outcomes and identify lessons learned.
• Mentor project managers and promote continuous improvement across PMO practices. 

• Bachelor's or Master's degree in Engineering, Materials Science, or related technical field.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven track record in managing complex, cross-functional projects in a high-tech environment.
• Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration.
• Excellent communication, leadership, and stakeholder management skills.

• Experience with IIoT hardware deployment and APC systems.
• Familiarity with Micron's PDE, CPI, and NPI frameworks.
• Knowledge of simulation modeling, yield enhancement, and defectivity analysis.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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