Plating Process Engineer

2 days ago

Singapore ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. Full time $90,000 - $120,000 per year

Job Responsibilities

Process Development

  • Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
  • Evaluate new chemicals, materials, and equipment for plating process enhancement.
  • Establish plating parameters to ensure uniform thickness, adhesion, and reliability.

Process Control & Monitoring

  • Monitor plating bath chemistry and maintain proper control limits.
  • Implement Statistical Process Control (SPC) and DOE to analyze process capability.
  • Troubleshoot process and equipment issues to improve yield and throughput.

Yield & Quality Improvement

  • Conduct root cause analysis of plating defects.
  • Work with quality and reliability teams to address substrate failure mechanisms.
  • Drive continuous improvement initiatives to enhance quality and cost efficiency.

Cross-Functional Collaboration

  • Interface with design, manufacturing, equipment, and suppliers to meet production goals.
  • Support new product introductions (NPI) and qualification of plating processes.

Documentation & Compliance

  • Maintain detailed documentation of plating recipes, process controls, and specs.
  • Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

  • PhD or Master's degree in Chemical Engineering, Materials Science, or related field.
  • 5–10+ years of experience in semiconductor packaging or PCB/substrate manufacturing.
  • Hands-on experience with copper/nickel/tin plating processes.
  • Familiarity with tools such as XRF, SEM, profilometer, and electroplating equipment.
  • Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

Specialized Knowledge & Skills:

  • Strong analytical and problem-solving skills.
  • Knowledge of surface treatment, adhesion promotion, and via filling techniques.
  • Familiar with lean manufacturing, Six Sigma, or SPC tools.
  • Excellent communication and teamwork abilities.

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