Mechanical Design Engineer – Die Ejection Systems

5 days ago

Sembawang, Singapore Pyxis CF Pte Ltd Full time $120,000 - $200,000 per year

We are seeking an experienced Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The ideal candidate will have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities
  • Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
  • Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
  • Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
  • Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
  • Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
  • Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
  • Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
  • Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
  • Analyze yield loss due to ejection-related defects and implement design or process improvements.
  • Support cross-functional teams in root-cause analysis and failure prevention.
Required Qualifications
  • Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
  • 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
  • Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
  • Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
  • Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
  • Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
Preferred Experience (Definite Plus)
  • Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
  • Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
  • Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
  • Experience collaborating with process, electrical, and software teams in semiconductor tool development.
Soft Skills
  • Strong analytical and problem-solving abilities.
  • Excellent communication and cross-functional collaboration skills.
  • Self-motivated and able to work independently in a fast-paced environment.
Why Join Us
  • Opportunity to design next-generation thermocompression and die handling equipment for advanced packaging nodes.
  • Work with leading experts in semiconductor equipment innovation.
  • Higher than market compensation and growth opportunities in a high-impact R&D environment.

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