Adv Packaging Principal Yield Engineer

7 days ago

North Region, Singapore GlobalFoundries Full time $120,000 - $200,000 per year

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

Summary of Role: The ULP CMOS product team is looking to hire a yield engineer to join our growing Advanced packaging team in our Singapore facility.  Applicants for this position would be responsible for monitoring yield health of the development programs in the advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer.  Areas of focus could include monitoring in-line inspection, measurements and electrical performance of the features we are developing for the advanced packaging support of the full ULP CMOS suite of products.

Essential Responsibilities:

  • The advanced packaging yield will drive yield and product enhancement for technology nodes across the ULP CMOS product lines for multiple development opportunities.
  • This role supports advanced packaging yield learning and requires strong partnership and collaboration with the broader SGP module engineering team and process integration to report signals and reports of health of these programs.
  • Investigate root cause of yield and product functionality issues. Use electrical data analysis, failure isolation, product and design information, device knowledge, and technology understanding to identify solutions. Include learning from test chips and test structures for yield limiter determination and improvement.
  • Integrate physical and electrical data to establish yield/ defectivity paretos and roadmaps.
  • Work with internal and external test and assembly sites to maximize electrical feedback to the factory.
  • Develop and improve yield characterization and data analysis methodologies to determine yield limiters, correlation to in-line defectivity, and electrical parametric signals.
  • Support process module engineering activities to improve cost, cycle time, and manufacturing readiness.
  • Ensure methods and processes in place to test the devices and structures being developed
  • Analyze various data, physical, electrical or defect reports to determine trends and recommend corrective actions
  • May require creation of presentations to provide occasional management or external customer updates.
  • Work and collaborate other projects and/or assignments as needed

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
  • Travel

  • Laser Process Engineer Advanced Packaging

    3 days ago

    North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

    Position title : Laser-Assisted Bonder (LAB) process engineer / Laser Process EngineerLocation: Admiralty StreetWorking Days:  5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)OverviewA LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision,...

  • Senior / Engineer – Yield & Process Integration

    7 days ago

    North-East Region, Singapore United Test And Assembly Center Limited (UTAC) Full time $80,000 - $120,000 per year

    Responsibilities:Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)Responsible to look into data analysis for yield and...

  • Principal Engineer

    4 days ago

    West Region, Singapore Poet Technologies Pte Ltd Full time $70,000 - $120,000 per year

    To be responsible for the development and measurement of optical communication products in accordance with the mission and the goals of the company. To identify, develop, implement and eliminate root causes of yield loss across fabrication and assembly processes and have predictive analytic to improve yield.DUTIES AND RESPONSIBILITIES :Yield and...

  • Yield Defect Associate Engineer

    4 days ago

    East Region, Singapore VISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD. Full time $104,000 - $130,878 per year

    About VSMC:VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing fab to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation devices and systems. If you share the same passion to pursue...

  • Principal Engineer

    7 days ago

    East Region, Singapore Vanguard International Semiconductor Singapore Pte. Ltd. Full time $104,000 - $130,878 per year

    Job Description· Develop custom or derivative processes to meet customer needs· Run DOE to optimize process margins and determine process & ET specifications· Monitor OOC, maintain good CPK for ET and monitor inline SPC parameters· Identify and resolve process integration issues & ET related problems· Identify yield opportunities and set preliminary...

  • Advanced Semiconductor Packaging Design Engineer

    11 hours ago

    North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Advanced Semiconductor PackagingLocation: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewA TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in...

  • Principal Engineer

    7 days ago

    North Region, Singapore GlobalFoundries Full time $150,000 - $200,000 per year

    Intro to GFGlobalFoundries (GF) is one of the world's leading semiconductor foundries and the only one with a truly global footprint spanning three continents. We manufacture complex, feature-rich integrated circuits that enable billions of electronic devices. At GF, we make things that matter — from the solutions that enable the way we live today, to the...

  • Process Engineer

    7 days ago

    North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

    Position title : Laser-Assisted Bonder (LAB) process engineerLocation: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)OverviewA LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced...

  • CMP Principal Engineer

    7 days ago

    East Region, Singapore Systems on Silicon Manufacturing Co Pte Ltd Full time $90,000 - $120,000 per year

    SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.We're looking for innovative, passionate, and talented people...

  • Laser Bonding Engineer

    3 days ago

    North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

    Position title : Laser-Assisted Bonder (LAB) process engineerLocation: Admiralty Street (Sembawang)Working Days:  5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)OverviewA LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision,...