Mechanical Design Engineer TCB

2 days ago

North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location: Admiralty Street

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

  • Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
  • Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
  • Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
  • Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
  • Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
  • Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
  • Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
  • Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
  • Analyze yield loss due to ejection-related defects and implement design or process improvements.
  • Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

  • Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
  • 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
  • Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
  • Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
  • Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
  • Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
  • Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
  • Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
  • Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
  • Experience collaborating with process, electrical, and software teams in semiconductor tool development.

Interested Personal kindly email to :

Lydia Chieng Zhi Yee Reg No: R1988890

The Supreme HR Advisory Pte Ltd EA No: 14C7279

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