Laser-Assisted Bonder
6 days ago
Position title : Laser-Assisted Bonder (LAB) process engineer
Location: Nearest MRT: Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
- Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
- Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
- Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
- Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
- Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
- Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
- Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
- Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
- Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
- Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
- Familiarity with advanced process control and manufacturing best practices
- Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
- Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
- Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Samuel Siaw
The Supreme HR Advisory Pte Ltd
EA No: 14C7279
Reg No: R2412474
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