Equipment Design Engineer – Thermo-Compression Bonding

5 days ago

North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development
  • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  • Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
  • Oversee fabrication of prototype modules and their integration with TCB platforms.
  • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
  • Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
  • Document all designs, simulations, and test results according to quality management and IP standards.
  • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
  • Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  • Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  • Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
  • Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

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