Senior / Engineer – Wafer Bumping Equipment

Role OverviewLead and drive the 12" wafer bumping engineering team, overseeing process development, optimization, and qualification. Provide strategic direction, ensure high yield and quality, and align technology roadmap with industry trends.Key ResponsibilitiesProvide leadership and strategy for bumping engineering teamDevelop, optimize, and qualify 12"...

About Stats ChipPACAt Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow's technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies...

Responsibilities:Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)Responsible to look into data analysis for yield and...

Job Responsibilities;1) Prepare Engineering build requests, electronic Special Work Request, materials, Wafer Map until shipment and all other documentation to start and execute engineering builds.2) Conduct routine inspection, data collection of measurement to meet product requirement 3) Follow standard operation procedure(SOP), work instruction and OCAP...

5 days week ; Normal office hourTraining in Korea for 2 monthsSemicon Wafer Process experienceSummary•To design and develop advanced wafer processes and materials tailored to customer product requirements, optimize process performance and yield, and ensure robust and reliable production in semiconductor advanced packaging.Job• Design and development of...

Package Design Engineeris responsible for product and tooling design.Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.ResponsibilitiesWith reference to internal design guidelines, work with the internal & external customer to:Generate, update, and revise electrical routing layout based on the...

Role Overview:We are seeking a skilled NPI Engineer with strong expertise in wafer bumping processesto lead and manage customer and internal projects from initiation to production. This role is critical in driving new product introductions, ensuring process integration, and supporting cross-functional collaboration to meet technical and quality...

Package Design Engineeris responsible for product and tooling design.Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.ResponsibilitiesWith reference to internal design guidelines, work with the internal & external customer to:Generate, update, and revise electrical routing layout based on the...

Our client is seeking an Associate Engineer to join their teamAbout Our ClientOur client is the world's largest provider of independent semiconductor manufacturing services. As a global leader, they specialize in assembly, test, materials, and design manufacturing. The company is committed to meeting the industry's growing demands for faster, smaller, and...

ResponsibilitiesPerform equipment installation, tool improvement activities, maintenance, alarm compilation of equipmentPerform repair, troubleshooting of equipment to minimize downtimeIdentify equipment failures, pareto of issues and weak point analysis for improvementDrive continuous improvement program, cost reduction, yield & OEE improvementGenerate...