Senior / Engineer – Wafer Bumping Equipment

About CompanyHiring Company is an international, industry-known brand that provides high-end process equipment for fast-growing specialty applications in the semiconductor industry. Our Company designs and manufactures wet chemical etching and wet cleaning equipment for our customer who are wafer fabs worldwide. Our products are integrated in the global...

Role OverviewLead and drive the 12" wafer bumping engineering team, overseeing process development, optimization, and qualification. Provide strategic direction, ensure high yield and quality, and align technology roadmap with industry trends.Key ResponsibilitiesProvide leadership and strategy for bumping engineering teamDevelop, optimize, and qualify 12"...

Summary:Responsible for driving strategic initiatives and operational excellence across wafer equipment.Strong leadership to oversee equipment performance, productivity improvement, cost reduction, and alignment with overall manufacturing goals.Responsibilities:• Develop and implement strategies to ensure operational growth and continuous improvement...

Responsibilities:Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)Responsible to look into data analysis for yield and...

SummaryTo develop and optimize AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines, and to support customer and internal quality requirements.Job• Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes• Operate and optimize 2D/3D AOI systems and...

TCB (Thermo Compression Bonding) Design EngineerLocation: 8 Admiralty Street #06-13, Singapore 757438Working Days:  5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewA TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding...

About VSMCVisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing facility to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation devices and systems. If you share the same passion to pursue...

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) is a Joint Venture between NXP and TSMC. We offer flexible and cost-effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.We're looking for innovative, passionate, and talented people...

THE ROLE:To provide in-depth technical assistance and resolution when engineering problems are encountered before, during, and after, new product/equipment introduction and deployment. Through collaboration with internal and external developer/OEM, identify, define, and resolve developmental problems affecting test results, operational effectiveness, and...

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.We're looking for innovative, passionate, and talented people...