Senior / Engineer – Wafer Bumping Equipment

Responsibilities:Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customerMaintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full productionReviews and analyses...

Responsibilities:Provide strategic direction and leadership for the 12" bumping engineering team, aligning with company goals and objectivesOversee the development, optimization, and qualification of 12" bumping processes, ensuring high yield, quality, and reliabilityDevelop and execute a technology roadmap for 12" bumping, staying ahead of industry trends...

About CompanyHiring Company is an international, industry-known brand that provides high-end process equipment for fast-growing specialty applications in the semiconductor industry. Our Company designs and manufactures wet chemical etching and wet cleaning equipment for our customer who are wafer fabs worldwide. Our products are integrated in the global...

Role OverviewLead and drive the 12" wafer bumping engineering team, overseeing process development, optimization, and qualification. Provide strategic direction, ensure high yield and quality, and align technology roadmap with industry trends.Key ResponsibilitiesProvide leadership and strategy for bumping engineering teamDevelop, optimize, and qualify 12"...

Summary:Responsible for driving strategic initiatives and operational excellence across wafer equipment.Strong leadership to oversee equipment performance, productivity improvement, cost reduction, and alignment with overall manufacturing goals.Responsibilities:• Develop and implement strategies to ensure operational growth and continuous improvement...

Responsibilities:Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)Responsible to look into data analysis for yield and...

5 days week ; Normal office hourTraining in Korea for 2 monthsSemicon Wafer Process experienceSummary•To design and develop advanced wafer processes and materials tailored to customer product requirements, optimize process performance and yield, and ensure robust and reliable production in semiconductor advanced packaging.Job• Design and development of...

Package Design Engineeris responsible for product and tooling design.Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.ResponsibilitiesWith reference to internal design guidelines, work with the internal & external customer to:Generate, update, and revise electrical routing layout based on the...

Package Design Engineeris responsible for product and tooling design.Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.ResponsibilitiesWith reference to internal design guidelines, work with the internal & external customer to:Generate, update, and revise electrical routing layout based on the...

ResponsibilitiesPerform equipment installation, tool improvement activities, maintenance, alarm compilation of equipmentPerform repair, troubleshooting of equipment to minimize downtimeIdentify equipment failures, pareto of issues and weak point analysis for improvementDrive continuous improvement program, cost reduction, yield & OEE improvementGenerate...