Semicon Design Engineer

6 days ago

North Region, Singapore The Supreme HR Advisory Pte Ltd Full time $6,000 - $8,000 per year

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development

  • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

  • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  • Planning, Scheduling and Costing of Machines Modules.

  • Prototyping & Testing

  • Oversee fabrication of prototype modules and their integration with TCB platforms.

  • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

  • Process & Manufacturing Support

  • Collaborate with Electrical, Vision and Software Engineers for the machine integration.

  • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

  • Compliance & Documentation

  • Document all designs, simulations, and test results according to quality management and IP standards.

  • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis

  • Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.

  • Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  • Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

LIEW ONN KEE REG NO : R

THE SUPREME HR ADVISORY EA NO:14C7279

SCR-angel-liew

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