
Application Engineer
2 weeks ago
Position: Application Engineer (Dicer/ Grinder/ Laser) (Job ID: 19830)
- Ubi Avenue
- Basic + AWS + VB
Job Description:
- Grinder Process development support for customer
- Perform in house application test cut and on site customer support
- Process development support to customer
- Process customer claim for abrasive product
- Good knowledge on blade / wheel / Laser technical support
- Required technical understanding
- Participate in company organized activities
- Promote good interdepartmental relationship
- Establish and maintaining good relationship with customers
- Communicate frequently with Engineer from Japan
Job Requirements:
- Dicer / Grinder/ Laser knowledge / experience is preferred
- Diploma in Mechanical, Electronic or any other engineering disciplines
- 1 - 2 years relevant working experience preferably in semiconductor industry
- Proficient in MS office – Powerpoint / Excel
- Willing to travel
- Pro-active, people & team-oriented
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Tan Katrina Therese Yap
EA Registration No: R
Pasona Singapore Pte Ltd
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