Principal / Senior Engineer, New Product Introduction - IC Packaging, Technical Operations Management

2 weeks ago

Singapore Continental Full time $90,000 - $120,000 per year
Company DescriptionJob Description
  • Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
  • Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
  • Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
  • Ensure Manufacturability and Product Ramp-Up.
  • Prepare and present reports on NPI project status, risks and milestones.
  • Drive Failure Analysis (FA) to identify Root Causes for issues.
  • Perform Risk Assessments such as Failure Mode and Effects Analysis.
  • Develop, align and monitor Qualification Process.
  • Interface to Quality Department for Quality Confirmation.
  • Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
  • Establish Part Traceability Concepts.
  • Conduct risk assessments and implement mitigation strategies
Qualifications
  • Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
  • Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
  • Preferable with strong technical proficiency in package and assembly processes.
  • Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
  • Strong problem-solving skills, results oriented and a quality-focused mindset.
  • Team player with proactive attitude, able to work independently and travel frequently.
Additional Information

Continental

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