Principal / Senior Engineer, New Product Introduction - IC Packaging, Technical Operations Mana

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies
  • Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
  • Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
  • Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
  • Ensure Manufacturability and Product Ramp-Up.
  • Prepare and present reports on NPI project status, risks and milestones.
  • Drive Failure Analysis (FA) to identify Root Causes for issues.
  • Perform Risk Assessments such as Failure Mode and Effects Analysis.
  • Develop, align and monitor Qualification Process.
  • Interface to Quality Department for Quality Confirmation.
  • Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
  • Establish Part Traceability Concepts.
  • Conduct risk assessments and implement mitigation strategies
  Read moreYour profile
  • Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
  • Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
  • Preferable with strong technical proficiency in package and assembly processes.
  • Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
  • Strong problem-solving skills, results oriented and a quality-focused mindset.
  • Team player with proactive attitude, able to work independently and travel frequently.
    • Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
    • Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
    • Preferable with strong technical proficiency in package and assembly processes.
    • Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
    • Strong problem-solving skills, results oriented and a quality-focused mindset.
    • Team player with proactive attitude, able to work independently and travel frequently.
    Read moreOur offer

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Continental develops pioneering technologies and services for sustainable and connected mobility of people and their goods. Founded in 1871, the technology company offers safe, efficient, intelligent and affordable solutions for vehicles, machines, traffic and transportation. In 2024, Continental generated sales of €39.7 billion and currently employs around 190,000 people in 55 countries and markets.

The Automotive group sector comprises technologies for passive safety, brake, chassis, motion and motion control systems. Innovative solutions for assisted and automated driving, display and operating technologies, as well as audio and camera solutions for the vehicle interior, are also part of the portfolio, as is intelligent information and communication technology for the mobility services of fleet operators and commercial vehicle manufacturers. Comprehensive activities relating to connectivity technologies, vehicle electronics and high-performance computers round off the range of products and services.