CMP Process Engineer

18 hours ago

West Region, Singapore Reeracoen Singapore Pte Ltd Full time $80,000 - $120,000 per year

Job title: CMP Process Engineer (Manager / Senior Engineer)

Reference ID: 36943

Salary Range: 8, ,000 SGD

Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.

Reports to: R&D Manager

【 Responsibilities 】

1) Process Development & Optimization

- Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.

- Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

2) Equipment & Tooling Support

- Define equipment specifications and validate CMP tools.

- Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

3) Yield & Quality Improvement

- Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).

- Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

4) Process Integration

- Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.

- Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.

5) Data Analysis & Documentation

- Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.

- Document standard operating procedures (SOPs), work instructions, and control plans.

6) Cross-Functional Collaboration

- Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).

- Assist with customer qualifications and reliability testing as needed.

【 What you will receive 】

- AWS

- Variable Bonus (based on company and individual performance)

- Annual Leave: 16 days (up to a maximum of 20 days)

- Medical Leave

- Family care leave (2 days/year)

- Dental care

- Company phone will be provided

【 Requirements & Preferences 】

(Must):

- PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.

- 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.

- Hands-on experience with CMP tools.

- Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or embedding.

- Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).

- Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).

- Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes.

- Strong analytical, documentation, and problem-solving skills.

- Effective communication and teamwork in a cross-functional environment.


We regret that only shortlisted candidates will be notified.

Registration No.: R Niltasha Binte Ibrahim)

Recruitment Licence: 12C5051

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