Principal / Senior Engineer, New Product Introduction - Wafer Technology, Technical Operations Management

2 weeks ago


Singapore Continental Full time $90,000 - $120,000 per year
Company DescriptionJob Description
  • Lead NPI process from Concept to Mass Production at Foundry (especially BCD, RF-CMOS), ensure collaboration between design, engineering, and manufacturing teams to maximize semiconductor technology optimization.
  • Ensure compliance with design rules and specifications while planning and evaluating silicon characterization results.
  • Develop and implement robust qualification processes, including the establishment of wafer acceptance criteria and comprehensive testing protocols.
  • Lead yield improvement initiatives through in-depth analysis of test data and resolution of issues encountered during the NPI process.
  • Produce comprehensive reports detailing project status, potential risks, and key milestones; execute thorough risk assessments for foundry excursions and return material authorizations.
  • Implement and oversee sophisticated data exchange protocols between foundry, Outsourced Semiconductor Assembly and Test (OSAT) providers, and Continental to facilitate effective yield monitoring and quality control.
  • Drive continuous improvement in wafer technology processes, identifying opportunities for enhanced efficiency, cost reduction, and quality improvement.
  • Develop and maintain strong relationships with key suppliers and technology partners, staying abreast of industry trends and emerging technologies in semiconductor manufacturing.
Qualifications
  • Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
  • Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
  • Preferable with strong technical proficiency in wafer manufacturing, process integration and/or device engineering.
  • Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
  • Strong problem-solving skills, results oriented and a quality-focused mindset.
  • Team player with proactive attitude, able to work independently and travel frequently.
Additional Information

Continental



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