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Engineer-cad/cam

2 weeks ago

Singapore PEP INNOVATION PTE. LTD. Full time

**Job Functions**:

- Import Customer design into CAM systems and Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
- Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
- Itemize and correspond to design Issues with customers.
- Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
- Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
- Recommend new design concepts and validate the concept feasibility using circuit simulations.
- Reviews drawings to extract customers specifications for the manufacturing process and to extract customer-specific flow-down requirements
- Creates Work Instructions for CAM and Tooling Engineers
- Enters Process Instructions into ERP-System to create the Traveler Instructions and Releases ERP-System manufacturing travellers to Production planner.
- Modify various aspects of Circuit image such as line widths, pad sizes, etch comp and annular ring to ensure compliance with engineering standards
- Create computer files to panelize data and output data for production use (Drill, LDI, AOI and test data)
- Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
- Perform other related duties as assigned by management.
- **Job Requirements**:

- Degree / Diploma in Electronic Engineering or equivalent
- Good engineering foundation and technical knowledge
- PCB / Substrate manufacturing knowledge
- Proficient with Auto-CAD
- Experience using CAM tooling software Orbotech - InCAM
- Background on IC packaging / assembly processes and experience in using CAD tools for substrate design software is an added advantage
- Knowledge with semiconductor wafer level packaging assembly, wire bond and fan-in /fan-out is an added advantage
- At least 3 years' drafting experience with ISO knowledge
- Good interpersonal, presentation & communication skills
- Passionate R&D with optimistic mindset
- Ability to research, develop and implement new technology and manufacturing techniques
- Well organized and independent and team player
- Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.