Internship - Process Engineer

4 days ago


Singapore Technoform Edge Bond Solutions Singapore Pte Ltd Full time

Company

Technoform Edge Bond Solutions Singapore Pte Ltd

Designation

Internship - Process Engineer

Date Listed

16 Sep 2024

Job Type

Entry Level / Junior Executive
- Intern/TS

Job Period

From Jan 2025, For At Least 5 Months

Profession

Engineering

Industry

Precision Engineering

Location Name

Pioneer Crescent, Singapore

Address

Pioneer Cres, Singapore

Map

Allowance / Remuneration

$1,000 monthly

Company Profile

Technoform specializes in the extrusion of thermoplastic profiles. This specialization applies particularly to the manufacture and development of insulating profiles for aluminum windows, doors, and facades.

**Job Description**:

- Dive deep into understanding our manufacturing workflows and process steps to identify gaps and business challenges for business continuity and improvement planning.
- Benchmark with industry best practices internally within our global networks and externally with industry.
- Collaborating with multi-functional teams to identify issues and resolve issues.
- Develop and lead process improvement implementation plan.
- Working with the technical team in developing and leading process improvement implementation plan.
- Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.
- Looking for a minimum of 3 months internship
- Ability to learn quickly in a rapidly changing environment
- Excellent organizational, analytical skills and attention to detail
- Superb communication skills

Application Instructions
- Possess a strong sense of responsibility
- Enjoy working in a fast pace environment
- Be a team player, with the open mindedness to work in teams of different culture
- Possess good interpersonal skills, able to communicate to all levels of staff effectively
- Aptitude for problem solving
- Ability to work independently
- Non-hierarchical



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