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Process Engineer
2 weeks ago
**Basic information**:
- Mon
- Fri
- 745am - 445pm
- Transport allowances provided
- West Region
- Basic up to $4200 + AWS + VB
**Job Scope**:
**Plating Workflow Design & Optimization**:
- Architect and continuously refine end-to-end wafer plating workflows to ensure alignment with throughput targets, process stability, and quality compliance.
- Drive optimization of plating operations by integrating lean manufacturing principles, automation, and feedback loops for enhanced efficiency.
**Technical Documentation Development**:
- Author and maintain comprehensive work instructions, standard operating procedures (SOPs), and control documents tailored to plating processes.
- Ensure documentation supports operator training, process consistency, audit readiness, and quality management systems (QMS).
**Process Simulation & Data Analytics**:
- Collect, interpret, and visualize process data to uncover trends, deviations, and improvement opportunities in plating performance.
- Utilize simulation tools (e.g., COMSOL, CFD software, or in-house models) to model current-state process behavior and test parameter variations for optimization.
**Continuous Improvement & Yield Enhancement**:
- Lead initiatives targeting plating quality improvement, yield maximization, and throughput enhancement across production lines.
**Troubleshooting & Root Cause Analysis**:
- Act as the primary technical point of contact for plating-related anomalies; investigate production issues using tools such as Ishikawa diagrams, 5 Whys, and FMEA.
- Implement corrective and preventive actions (CAPA) to ensure sustainable resolution and avoid recurrence of plating defects.
**Cost Reduction & Resource Efficiency**:
- Identify and execute strategies to minimize consumables usage (e.g., plating baths, additives), streamline material flow, and lower energy/water usage.
- Collaborate with equipment engineering to reduce maintenance frequency and extend tool uptime, contributing to a lower cost per wafer.
**Job requirement**:
- **Experience**: Minimum of **2 years of hands-on experience**in **chemical/electroplating processes**; relevant **internship or co-op experience**in plating or surface treatment environments also considered
- Strong foundation in materials behavior, chemical processes, and surface engineering principles would be an added advantage
- Familiarity with cleanroom protocols, semiconductor manufacturing, or advanced manufacturing environments preferred
We wish you all the best in your career search.
**Zen Career Pte Ltd | 24C2559**
**Ang Jia Hong (Cody)| R24126406
