Principal Engineer

1 day ago

Singapore Poet Technologies Pte Ltd Full time

Roles and Responsibilities
- Design and Develop HIPP integration technology incorporating the POET Optical Interposer, InP-active devices, third party photonics devices (such as Silicon Photonic chips) & third-party electronics-chips.
- Delivery of HIPP building blocks and their integration solutions for ROE (Receive Optical Engine), TOE (Transmit Optical Engine), TROE (Transmit-Receive Optical Engine) in line with the company development requirements and timeline.
- Participate with the HIPP team to coordinate the design-integration with the Optical Interposer development team, with the InP-based Product Development Team and with company-appointed third-party photonic/electronic chip providers, and to execute the HIPP process development to realize ROE/TOE/TROE prototypes deliverables.
- Develop HIPP building blocks including wafer-level precision photonics die attach, 3rd-party chip attach, stealth dicing, encapsulation, hermetic capping process, fiber-subassembly/coupling methods; to coordinate on additional processing needed for HIPP assembly, to coordinate HIPP preparation for assembly wafer/unit/evaluation board testing, and to carry out HIPP reliability qualifications.
- Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; and contribute in planning and execution of essential improvement program
Provides documentation & regular technical reporting, and technical support and coordination with the Company NPI teams to fulfil the Company Technology and Product Development programs.

**Minimum Education**

Bachelor Degree in Electrical/Electronic/Computer engineering, Physics, Optical/Photonics engineering and related to one of these is preferred

Minimum Experience
- Minimum 5 years’ working experience with technical background in electrical/optoelectronics packaging, or optomechanical assembly and test environment
- Work experience in new product and/or new process development and qualification

**Specific Knowledge / Skills**
- Electronic packaging knowledge, with hands-on experience in die-bonding is a must. Photonic packaging knowledge is a plus.
- Hand-on experience with die-assembly tool, flip-chip bonder, wire bonder, and CAD drawing is strongly recommended.
- Understanding with packaging of semiconductor wafer is a plus.
- Knowledge of up-to-date production and automation equipment, processes, designs and functions
- Excellent written and verbal communication skills
- Proven organizational skills and multi-tasking skills

**Job Types**: Full-time, Permanent, Contract
Contract length: 36 months

Schedule:

- Day shift
- Late shift
- Monday to Friday
- Weekend availability

COVID-19 considerations:
Follow the government protocol of Covid 19 precautions. Must be fully vaccinated.

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