Inkjet Product and Outsource Integration Engineer

1 day ago

Bukit Merah, Singapore Hewlett Packard Full time

**What an Inkjet Product & Outsource Integration Engineer does at HP**:

- Ideates, develops and implements integrated Micro-Electro Mechanical Systems (MEMS) engineering solutions to deliver to new MEMS Printhead product and/or resolve MEMS Printhead quality issues.
- Develops MEMS qualification plans, test plans and perform characterization to qualify Printhead product changes, with minimum risk to both internal and external customer experience.
- Collaborates with WW Supplies and Hardware R&D partners, Supplies Operations and Business partners to enable Printhead New Product Introductions and drive Printhead Extensions Development.
- Leads and drives solutions across HP Thermal InkJet value chain in collaboration with Cross functional teams such as Process Integration Engineering, Circuit / Fluidic / Packaging Design Engineering, Hardware Engineering, Supplies Operations and Supply Chain, to enable revenue generation, incremental gross margin and customer experience improvement.
- Owns Engineering Responsibilities and/or Development Responsibility for MEMS Printhead Product.
- Manages external IC suppliers through SPM (Supplier Performance Management) framework. Tracking of key performance indicators, namely technology, quality, supply, cost to improve cost, quality, on-time delivery, lead times and strengthen relationship with suppliers.
- Works with external IC Supplier and HP E2E value chain partners (eg R&D, factory, customer assurance) to resolve quality escalations and drive speedy resolution and implement necessary changes to product / process to prevent recurrence of issues.
- Performs data extraction and analysis work using statistical analysis tools to improve / sustain wafer yield through monitoring of product yield and failure pareto trending. Derives insights from critical product and process parameters monitoring, highlight failures to the MEMS engineering team, problem solve and derive alternative solutions to improve products through Product Design / Process / Direct Material / Quality gates and/or specifications refinement.

**Individuals who do well in this role at HP, usually possess**:

- Bachelor's Degree in Electrical or Mechanical or other relevant Engineering Degrees.
- At least 3 years of experience in product engineering roles.
- Excellent understanding of semiconductor manufacturing, assembly, and test processes and/or semiconductor packaging design and process.
- Proven record for analytical problem solving and project management skills.
- Possesses good leadership, is innovative, self-driven, a team player and the ability to work independently.
- Strong focus on quality of work and on-time-delivery.
- Six sigma certification preferred.
- Project management certification preferred.** Disclaimer**
- Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision - to create technology that makes life better for everyone, everywhere._
- HP is a Human Capital Partner - we commit to human capital development and adopting progressive workplace practices globally._
- #Li-Post_

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