Engineer, High Bandwidth Memory(Hbm) Package Pe

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

**Responsibilities**
- Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
- Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations.
- Driving Cumulative Yield Ownership with cross functional teams and drive initiatives for overall Yield and Quality Improvement.
- Qual/Package Qual and RMA Packaging Related Issues.
- Front End and Back End Process Conversions: Work with FAB, TD, APTD, PDE Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products.
- Data Analysis for Yield Improvement and Reliability: Utilizing in-house statistical tools/machine learning/AI for engineering data analysis to improve yields and reliability and implement within the Dispo workflow.
- Create a deviation alert system for yield loss, char/param trend, wafer/die/cube shading.
- Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
- Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.
- Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

**Requirements**:

- Bachelors/Masters in Electrical and Electronics Engineering Degree or related field.
- Demonstrating Strong Leadership Skills and Technical Skills.
- Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
- Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
- Strong sense of responsibility and accountability towards assigned role with professional work ethic.
- Work on site in Singapore with international travel to Taiwan.

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.