Staff Product Development Engineer

2 weeks ago

Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

AMD together we advance_

**Responsibilities**:
**THE ROLE**:
Pursuing a challenging and dynamic career in a fast paced, technological bleeding edge lab environment working on failure analysis and characterization of advanced semiconductor products, packaging and materials.

**THE PERSON**:
Strong problem-solving ability. Able to excel independently yet work savvily in a team. Resilient, organized, attentive to details and able to work under pressure and tight timeline. Good interpersonal and communication (written/spoken) skills.

**KEY RESPONSIBILITIES**:

- Device Analysis of High-Performance Computing Microprocessors / Artificial Intelligence Graphics modules / High Bandwidth Memory / Advanced Packaging to enable new Product Development, Yield Reliability Qualification and resolve customer issues
- Develop new electrical fault isolation techniques and work with sample preparation domain experts to prepare samples for next gen SOIC package EFI.
- Operate advanced analytical tools to perform Electrical Fault Isolation (EFI), Non-Destructive Testing (NDT) and Physical Failure Analysis (PFA) to drive root cause analysis
- Report writing to collate and present concise analysis data/findings
- Collaboration with stakeholders and cross-functional product/design/quality teams for root cause debug and resolve complex product issues
- Collaborate with vendors and research institutes to lead technical/evaluation projects to develop new Device Analysis techniques to support Advanced Packaging roadmap
- Authorship in renowned International Technical Conferences (e.g. IPFA, EPTC, ISTFA)
- Analytical tools ownership and Lab / strategic administrative duties

**PREFERRED EXPERIENCE**:

- Experience in similar analytical lab environment
- Experience in Xray, CSAM, SEM, EDX, FIB
- Knowledge in advanced EFI tools such as lock-in-thermography, OBIRCH, magnetic field imaging
- Knowledge in Semiconductor SOIC device analysis, Advanced packaging and reliability testing
- Strong electrical engineering background to understand ATE tester program and investigate new EFI methodologies to support SOIC die-to-die (D2D) fault isolation and debug for next gen advance packaging FA.
- Experience in co-package optics and/ or photonics related knowledge is advantageous.

**ACADEMIC CREDENTIALS**:

- Bachelor/Masters/PhD in Materials / Electrical / Microelectronics Engineering

**LOCATION**:
Singapore

LI-MM1

Qualifications:

- Benefits offered are described: _AMD benefits at a glance_._

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