
Process Engineer Backend Packaging
6 days ago
**Company**: RF360 Singapore Pte., Ltd.
**Job Area**: Engineering Group, Engineering Group > Hardware Engineering
**General Summary**:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
**Minimum Qualifications**:
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Description of Job:
- Responsible for backend semiconductor packaging processes which wafer bumping, wafer singulation, backgrind and wafer mounting.
- Effectively providing engineering support in order to meet production output, product quality, efficiency, productivity, yield, cycle time and safety requirements.
- Responsible to analyse the process data and identify improvement actions and work on the improvement.
- Drive permanent solutions to resolve chronic process and quality issues.
- Responsible to evaluate new product/material/process during the pilot run and ensure process readiness.
- Responsible for the relevance of the Work Instructions, Control Plan, FMEA & Process Control documents.
- Responsible to prepare the line for internal & external audits and the follow-up actions
Qualifications:
- Bachelor Degress in Engineering (Mechanical / Material / Chemical or similar qualifications)
**Skills**:
- Proficiency in data analysis, problem-solving and critical thinking.
- Good communication and collaboration skills to work effectively with cross-functional teams.
- Good planning and organizational skills.
- Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.
Experience / Any Other Special skills/attributes:
- Preferably 2 years of related working experience in semiconductor assembly manufacturing as process engineer.
- Knowledge of statistical and quality tools such as SPC and MSA is preferred.
- Able to work under pressure and strong commitment to work.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
If you would like more information about this role, please contact Qualcomm Careers.
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