Senior Backend Process Quality Specialist

10 hours ago

Singapore beBeeSemiconductor Full time

Backend Semiconductor Packaging Process Engineer

We are seeking a highly skilled Backend Semiconductor Packaging Process Engineer to join our team. The successful candidate will be responsible for developing and deploying inspection procedures to ensure conformance of material to be released.

This is a challenging opportunity for a seasoned professional with experience in semiconductor manufacturing environments. The ideal candidate will have a strong foundation in process engineering, yield improvement, and quality control.

The selected candidate will lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement. They will also be responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.

The job requires the ability to analyze data using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making. The candidate must also be able to drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.

Key Responsibilities:

  • Lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement.
  • Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.
  • Develop or enhance procedures and work instructions related to backend PQC processes.
  • Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.
  • Analyze data using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making.
  • Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.

Requirements:

  • Bachelor's Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).
  • Minimum 5 years of relevant experience in backend semiconductor packaging processes and quality control.
  • Strong foundation in process engineering, yield improvement, and quality control.
  • Proficient in SPC and data analysis tools.
  • Familiarity with FMEA, Control Plans, and OSAT backend processes.
  • Hands-on experience with new product and process evaluations.

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