Senior Research Engineer

2 days ago


Singapore A*STAR Agency for Science, Technology and Research Full time

**Position Overview**: We are seeking a highly skilled and motivated Senior Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.
**Key Responsibilities**:
**Innovative Process Development**: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding, focusing on pre-assembly processes such as Auto-Optical Inspection, backgrinding, dicing and IR metrology Inspection.
**Evaluation and Characterization**: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
**Project Collaboration**: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
**Intellectual Property and Reporting**: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
**Mentorship and Leadership**: Provide guidance and support to less experienced colleagues. Lead small-scale projects, managing risks and resource allocation effectively.
**Customer and Market Engagement**: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

**Requirements**:
**Educational Background**: Master's degree or Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
**Experience**: Minimum of 5 years of experience in process development or packaging R&D, with a strong track record in advanced packaging technologies.
**Preferred Skills**: Experience in backgrinding, dicing, and pre-assembly processes is highly desirable.
**Type of Employment**: Full-Time
**Minimum Experience**: 5 Years
**Work Location**: Science Park


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