Engineer - Bond/Grind/Trim Process Dev

2 weeks ago

Singapore Micron Technology Full time

Join to apply for the Engineer - Bond/Grind/Trim Process Dev role at Micron Technology 2 days ago Be among the first 25 applicants Join to apply for the Engineer - Bond/Grind/Trim Process Dev role at Micron Technology Get AI-powered advice on this job and more exclusive features. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Micron's NAND Technology Integration (NTI) Singapore TD group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Responsibilities Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes.

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