Senior/Engineer, Advanced Packaging Integration
1 day ago
Senior/Engineer, Advanced Packaging Integration - Assembly page is loaded
Senior/Engineer, Advanced Packaging Integration - Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted 8 Days Ago job requisition id JR76660
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron's vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
-
Singapore Micron Technology Full timePrincipal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/...
-
Engineer, Advanced Packaging Integration
2 weeks ago
Singapore Micron Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
-
Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...
-
Engineer, Advanced Packaging Integration Engineering
13 hours ago
Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time $100,000 - $150,000 per yearMicron's vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to...
-
Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeRoles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...
-
Advanced Packaging Integration Specialist
4 days ago
Singapore beBeeIntegration Full time $180,000 - $250,000Job Description:We are seeking a skilled Advanced Packaging Integration Engineer to join our team. As an integral component of our Advanced Packaging Technology Development group, you will be responsible for developing and enabling advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule...
-
Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...
-
Advanced Packaging Integration Specialist
1 week ago
Singapore beBeeInnovator Full time $180,000 - $250,000Job SummaryWe are looking for a talented Advanced Packaging Integration Engineer to join our team in delivering cutting-edge package development for high-performance memory products.This is an exciting opportunity for a motivated individual who can drive innovation, improve product quality, and enhance productivity.Key Responsibilities:Develop and enable...
-
Singapore Micron Technology Full timeSenior Engineer, Advance Packaging Product Integration Join to apply for the Senior Engineer, Advance Packaging Product Integration role at Micron Technology Senior Engineer, Advance Packaging Product Integration 1 day ago Be among the first 25 applicants Join to apply for the Senior Engineer, Advance Packaging Product Integration role at Micron...
-
Singapore beBeePackaging Full timeJob Description:We are seeking a skilled Engineer to join our team in Advanced Packaging Integration Engineering.The ideal candidate will have expertise in package development for high-performance memory products and will be responsible for delivering cutting-edge solutions that meet the needs of our customers.This is an exciting opportunity for a motivated...
